Development of Molding Method of Carbon Fiber Reinforced Thermoplastics by Using Direct Resistance Heating and Induction Heating

chemical recycling of polycarbonate waste using conventional heating and microwave assisted method

پلی کربنات یکی از پلاستیکهای مهمی است که به صورت گسترده در تولید لوحهای فشرده، قطعات رایانه، مواد ساختمانی و غیره مورد استفاده قرار می گیرد. این پلیمر بصورت عمده از تراکم مونومر بیس فنولa (bpa) و کربنیل کلرید یا دی متیل کربنات ها بدست می آید. در سالهای اخیر بازیافت شیمیایی پلی کربنات بیشتر مورد توجه بوده است. بازیافت شیمیایی پلی کربنات برای بدست آوردن مواد اولیه آن با روشهای متفاوتی مانند تجزی...

Designing of the Heating Process for Fiber- Reinforced Thermoplastics with Middle-Wave Infrared Radiators

Manufacturing components of fiber-reinforced thermoplastics requires three steps: heating the matrix, forming and consolidation of the composite and terminal cooling the matrix. For the heating process a pre-determined temperature distribution through the layers and the thickness of the pre-consolidated sheets is recommended to enable forming mechanism. Thus, a design for the heating process fo...

Controlled Resistive Heating of Carbon Fiber Composites

Temperature control is the key to effective resistive heating for composite rigidization. The ability to monitor and even control the temperature provides an active control strategy in prescribing and predicting the stiffness of the hardened composite. Further, understanding how the material responds to an electrical input determines both the type of control to be used as well as the level of c...

Development of a Model for Induction Heating

Direct Silicon–Silicon Bonding by Electromagnetic Induction Heating

A novel heating technique, electromagnetic induction heating (EMIH), uses electromagnetic radiation, ranging in frequency from a few megahertz to tens of gigahertz, to volumetrically heat silicon above 1000 C in only a few seconds. Typical power requirements fall between 900 to 1300 W for silicon wafers 75 to 100 mm in diameter. This technique has successfully produced direct silicon wafer-to-w...